Equipment for preventing particle back stream in semiconductor product device

专利摘要:
PURPOSE: An apparatus for preventing back stream of particles in semiconductor fabrication equipment is provided to prevent a back stream phenomenon of particles from a pump line into a chamber by intercepting a pump line before a vacuum control valve is closed. CONSTITUTION: A vacuum pump(40) is used for performing a pumping operation to form a vacuum state of a chamber(20). A vacuum control valve(22) is used for controlling a degree of vacuum of the chamber(20). A gate valve(38) is opened when the vacuum pump(40) perform the pumping operation. The first ball(26) is used for intercepting back stream of the first pump line(42). The first ball bracket(24) is formed on the first pump line(42) in order to intercept the first pump line(42). The second ball bracket(28) is formed on the first pump line(42) in order to receive the first ball(26). The second ball(32) is used for intercepting back stream of the second pump line(44). The third ball bracket(30) is formed on the second pump line(44) in order to intercept the second pump line(44). The fourth ball bracket(34) is formed on the second pump line(42) in order to receive the second ball(32).
公开号:KR20030009790A
申请号:KR1020010044419
申请日:2001-07-24
公开日:2003-02-05
发明作者:박봉진
申请人:삼성전자주식회사；
IPC主号:

专利说明:

EQUIPMENT FOR PREVENTING PARTICLE BACK STREAM IN SEMICONDUCTOR PRODUCT DEVICE}
[12] BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for preventing particle backstream in a semiconductor manufacturing facility. Particularly, when a power source is turned off in an apparatus for pumping gas in a chamber using a pump in a semiconductor manufacturing facility, particles of a pump line are backstream into the chamber. To prevent particle backstream from
[13] Generally, a semiconductor device is completed by repeatedly performing a manufacturing process on a silicon wafer, and the semiconductor manufacturing process may be divided into a diffusion process, an etching process, a photolithography process, and a film forming process. In such a process, in order to form a deposition film on a wafer substrate as a reactant or to perform uniform etching under high vacuum conditions, a vacuum pump is used to remove the air from the reactor or the chamber to reduce the pressure.
[14] 1 shows an apparatus for forming a chamber into a vacuum.
[15] A chamber 10, a vacuum pump 16 for performing a pumping operation to form the chamber 10 in a vacuum, and a vacuum control valve 12 for adjusting the degree of vacuum of the chamber 10 according to the opening angle. ), And the gate valve 14 that is normally opened when the pumping operation of the vacuum pump 16 is performed.
[16] Referring to FIG. 1, when the vacuum pump 16 performs a pumping operation, the chamber 10 is formed in a vacuum state. At this time, the gate valve 14 is normally opened when the pumping operation of the vacuum pump 16 is performed. In addition, when the vacuum detection unit (not shown) senses the vacuum degree of the chamber 10 and inputs it to the control unit (not shown), the control unit controls the degree of opening and closing of the vacuum control valve 12 to adjust the vacuum degree. However, the vacuum pump 16 may pump gas in the chamber 10 by pumping when power is supplied, but when the power of the vacuum pump 16 is turned off due to a power failure or an abnormality in the pump, the gate valve 14 may be discharged. And the vacuum control valve 12 is automatically closed. At this time, the speed of the back stream of the pump line is faster than the speed at which the gate valve 14 and the vacuum pump 16 are closed, and particles such as polymer adhered to the pump line are back streamed into the chamber 10. . Because of this, when particles are introduced into the chamber 10, the interior of the chamber 10 is contaminated and the chamber 10 is opened and cleaned to remove polymers such as gas. There was a problem that the productivity is lowered due to equipment down.
[17] Accordingly, an object of the present invention is to prevent particles from adhering to the pump line backstream to the chamber when the power of the vacuum pump is turned off during the process in the semiconductor manufacturing equipment to solve the above problems. It is to provide a backstream prevention device.
[18] Another object of the present invention is to prevent the inflow of particles adhering to the pump line to the chamber when the vacuum pump power is turned off in the semiconductor manufacturing equipment to prevent equipment down caused by the clean operation to improve the productivity It is to provide a particle backstream prevention device of the manufacturing apparatus.
[1] 1 is a configuration diagram of an apparatus for forming a chamber into a vacuum
[2] 2 is a block diagram of an apparatus for preventing particle backstream of a pump line according to an embodiment of the present invention
[3] 3 is a plan view showing an embodiment of the second and third ball brackets 28 and 34 of the present invention.
[4] 4 is a plan view showing another embodiment of the second and third ball brackets 28 and 34 of the present invention.
[5] 5 is a plan view showing another embodiment in which the second and third ball brackets 28 and 34 of the present invention have a mesh structure.
[6] 6 is a plan view of another embodiment in which the second and third ball brackets 28 and 34 of the present invention show a straight network structure.
[7] Explanation of symbols on the main parts of the drawings
[8] 20: chamber 22: vacuum control valve
[9] 24 and 30: first and third ball brackets 26 and 32: first and second balls
[10] 28 and 34: second and fourth ball brackets 38: gate valve
[11] 40: vacuum pump 42: first and second pump line
[19] Particle backstream prevention device of the semiconductor manufacturing apparatus of the present invention for achieving the above object, the vacuum pump for performing a pumping operation to form a chamber, the chamber into a vacuum, and the back stream of the first pump line is blocked A first ball bracket formed on the first pump line to block the first pump line when the first ball is moved in close contact with a backstream pressure when the vacuum pump is powered off; It is formed on the first pump line, a plurality of through holes are characterized in that it comprises a second ball bracket for accommodating the first ball during the pumping operation of the vacuum pump.
[20] Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the following description of the present invention, if it is determined that a detailed description of a related known function or configuration may unnecessarily obscure the subject matter of the present invention, the detailed description thereof will be omitted.
[21] 2 is a block diagram of an apparatus for preventing particle backstream of a pump line according to an exemplary embodiment of the present invention.
[22] A chamber 20, a vacuum pump 40 performing a pumping operation to form the chamber 20 in a vacuum, and a vacuum control valve 22 for adjusting the degree of vacuum of the chamber 20 according to the opening angle. ), The gate valve 38 normally opened when the vacuum pump 40 performs the pumping operation, the first ball 26 for blocking the backstream of the first pump line 42, and the vacuum control valve. It is formed on the first pump line 42 of the rear end of the 22 and the first ball 26 is in close contact by the backstream pressure when the vacuum pump 40 is powered off to block the first pump line 42 The first ball bracket 24 and the first pump line 42 are formed on the plurality of through-holes are formed to accommodate the first ball 26 during the pumping operation of the vacuum pump 40 It is formed on the second ball bracket 28, the second ball 32 for blocking the back stream of the second pump line 44, and the second pump line 44 in front of the gate valve 22 The second ball bracket 30 and the second pump line 44 which are in close contact with the second ball 32 due to the backstream pressure when the vacuum pump 40 is powered off and block the second pump line 44. It is formed on the, a plurality of through holes are formed in the fourth ball bracket 34 for accommodating the second ball 32 during the pumping operation of the vacuum pump (40).
[23] 3 is a plan view showing an embodiment of the second and third ball brackets 28 and 34 of the present invention.
[24] In the pumping operation of the vacuum pump 40, a ball storage part 50 for accommodating the first and second balls 26 and 32 and a vacuum pressure of the first and second pump lines 42 and 44 are allowed to pass. A plurality of through holes 54 and the support 52 for fixing the ball storage portion 50 is composed of.
[25] 4 is a plan view showing another embodiment of the second and third ball brackets 28 and 34 of the present invention.
[26] In the pumping operation of the vacuum pump 40, a ball storage part 60 for accommodating the first and second balls 26 and 32 and a vacuum pressure of the first and second pump lines 42 and 44 are allowed to pass. It is composed of a plurality of through holes 64 having a mesh structure, and a support 62 for fixing the ball storage unit 50.
[27] 2 to 4, the operation of the preferred embodiment of the present invention will be described in detail.
[28] When the vacuum pump 40 performs the pumping operation, the chamber 20 is formed in a vacuum state. At this time, the gate valve 38 is normally opened when the pumping operation of the vacuum pump 40. In addition, when the vacuum detecting unit (not shown) senses the vacuum degree of the chamber 20 and inputs it to the control unit (not shown), the control unit controls the degree of opening and closing of the vacuum control valve 22 to adjust the vacuum degree. However, the vacuum pump 40 may pump the gas in the chamber 20 by performing a pumping operation when power is supplied, but when the power of the vacuum pump 40 is turned off due to a power failure or an abnormality in the pump, the gate valve 38 may be discharged. And the vacuum control valve 22 is automatically closed. At this time, the speed of the back stream of the pump line is faster than the speed at which the gate valve 14 and the vacuum pump 16 are closed, so that the first and second pump lines 42 and 44 are back stream. At this time, when the vacuum pressure is applied in the direction of the chamber 20 through the second and fourth ball brackets 28 and 34 as shown in FIG. 3 or 4 by the back stream, the first and second balls 26 and 32 are applied. The pressure is moved to the first and third ball brackets 24 and 30 and closely adhered as shown by the dotted line in FIG. 2. This causes the first and third ball brackets 24 and 30 to be blocked by the first and second ball lines 26 and 32 to block the first and second pump lines 42 and 44, thereby providing the first and second pumps. Particles such as polymer adhering to the lines 42 and 44 are not back streamed into the chamber 10. As a result, particles do not flow into the chamber 10 from the pump line, and thus, the cleaning work for removing the polymer in the chamber 10 is not frequently performed, thereby preventing productivity from occurring and improving productivity.
[29] In FIGS. 3 and 4, the second and fourth ball brackets 28 and 34 have an accommodating part for accommodating the first and second balls 26 and 32, but do not include the accommodating part. It is possible to implement without departing from the scope of the present invention using a ball bracket having a mesh structure or a straight network structure as shown in FIG.
[30] As described above, the present invention provides a ball bracket and a ball on the pump line so that the pump line can be closed before the gate valve and the vacuum control valve are closed when the vacuum pump is turned off in the semiconductor manufacturing equipment to form the chamber in a vacuum state. The ball adheres closely to the ball bracket to block the pump line, preventing particles from entering the chamber by polymers adhered to the pump line, and preventing the contamination of the chamber. Since the work is not frequently performed, it is possible to prevent downtime of the equipment and increase productivity at the same time.

权利要求:
Claims (6)
[1" claim-type="Currently amended] In the particle backstream prevention device of the semiconductor manufacturing apparatus,
Chamber and
A vacuum pump performing a pumping operation to form the chamber into a vacuum;
A first ball for blocking the backstream of the first pump line,
A first ball bracket formed on the first pump line and blocking the first pump line when the first ball is moved in close contact with the backstream pressure when the vacuum pump is powered off;
The semiconductor manufacturing apparatus of the semiconductor manufacturing apparatus, characterized in that formed on the first pump line, a plurality of through holes are formed to include a second ball bracket for accommodating the first ball during the pumping operation of the vacuum pump Particle backstream protection.
[2" claim-type="Currently amended] The method of claim 1,
A second ball for blocking the backstream of the second pump line,
A third ball bracket formed on the second pump line and blocking the second pump line when the second ball is in close contact with the backstream pressure when the vacuum pump is powered off;
Particle backstream of the semiconductor manufacturing apparatus, characterized in that formed on the second pump line, a plurality of through holes are formed for receiving the second ball during the pumping operation of the vacuum pump; Prevention device.
[3" claim-type="Currently amended] The method according to claim 1 or 2, wherein the third and fourth ball brackets,
A ball storage part for accommodating the first and second balls during the pumping operation of the vacuum pump;
A plurality of through holes having a mesh structure for passing vacuum pressures of the first and second pump lines;
Particle backstream prevention device of a semiconductor manufacturing apparatus, characterized in that it comprises a support for fixing the ball housing.
[4" claim-type="Currently amended] The method according to claim 1 or 2, wherein the third and fourth ball brackets,
A ball storage part for accommodating the first and second balls during the pumping operation of the vacuum pump;
A plurality of through holes for passing the vacuum pressure of the first and second pump lines,
Particle backstream prevention device of a semiconductor manufacturing apparatus, characterized in that it comprises a support for fixing the ball housing.
[5" claim-type="Currently amended] The method according to claim 1 or 2,
And the third and fourth ball brackets have a mesh structure.
[6" claim-type="Currently amended] The method according to claim 1 or 2,
And said third and fourth ball brackets have a straight network structure.

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同族专利:

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引用文献:

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公开号 | 申请日 | 公开日 | 申请人 | 专利标题

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法律状态:
2001-07-24|Application filed by 삼성전자주식회사

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2001-07-24|Priority to KR1020010044419A

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2003-02-05|Publication of KR20030009790A

优先权:

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申请号 | 申请日 | 专利标题

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KR1020010044419A|KR20030009790A|2001-07-24|2001-07-24|Equipment for preventing particle back stream in semiconductor product device|